Work Experience
2024-Present
AMD
San Jose, California, USA
Debug and Diagnosis Team, Senior Member of Technical Staff
Experienced in silicon debug and DFT methodologies, focusing on pattern generation, validation, and failure analysis across ATE and custom platforms. Worked on HBM3 failure research and DFT improvements for MI300X, with close collaboration across DFX teams to enhance testability and debuggability
2022-2024
Qualcomm
San Diego, California, USA
Yield and Diagnosis Team, Senior Engineer
Focused on MBIST test and diagnosis, including verification methodology development and on-chip memory diagnostics. Contributions to burn-in screening, SPC/WS data analysis, and defect prediction systems in collaboration with the foundry.
2020-2022
Samsung Foundry
Hwaseong-si, South Korea
DFT Team, Staff Engineer
Experienced in DFT and ATPG for advanced nodes, including 3nm GAA-based mass production and customer product support.
Developed logic diagnosis methodology including cell-aware and layout-aware techniques, and drove volume diagnosis innovation for systematic defect detection using machine learning
Education
2014-2020
Yonsei University
Seoul, South Korea
Ph.D and Master degree in Electrical and Electronic Engineering
Thesis: Effective DRAM-based On-Chip Error Detection Methodology for Post-Silicon Debug
Lead MPW team for reliable Near Threshold Voltage aware processor
Participated with 7 projects sponsored by the Korean Government (Total project fund amount: $6M)
2007-2014
Yonsei University
Seoul, South Korea
Bachelor’s degree in Electrical and Electronic Engineering
Thesis: Effective DFT Methodology for 3D IC
GPA: 3.0/4.5
Paper and Patent
👨🎓Type | 🏅Title | 📗 Publisher | ⏲️Year |
Journal | IEEE Transactions on Computer (TCOM) | 2021 | |
Book | Post Silicon Validation and Debug (cited in Chapter 11.4.2.3) | Springer | 2019 |
Conference | International SoC Design Conference (ISOCC) | 2019 | |
Conference | International SoC Design Conference (ISOCC) | 2018 | |
Conference | International SoC Design Conference (ISOCC) | 2018 | |
Journal | PloS One | 2018 | |
Journal | IEEE Transactions on Computer (TCOM) | 2018 | |
Conference | International SoC Design Conference (ISOCC) | 2017 | |
Journal | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) | 2017 | |
Journal | Electronics Letters | 2017 | |
Journal | Sensors | 2017 | |
Journal | IEEE Transactions on Computer (TCOM) | 2017 | |
Patent | 온 칩 DRAM을 사용한 멀티코어 환경에서의 포스트 실리콘 디버그 장치 및 방법 | Korean Intellectual Property Office | 2017 |
Journal | IEICE Electronic Express | 2017 | |
Journal | IEICE Electronic Express | 2017 | |
Conference | IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) | 2016 | |
Conference | IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) | 2016 | |
Conference | International SoC Design Conference (ISOCC) | 2016 | |
Journal | IEEE Transactions on Computer (TCOM) | 2016 | |
Conference | International SoC Design Conference (ISOCC) | 2015 | |
Journal | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) | 2015 | |
Conference | Korea Institute Of Communication Sciences | 2015 | |
Conference | IEEE Asian Test Symposium | 2014 | |
Patents | 어플리케이션간 상호 광고노출을 통한 어플리케이션 광고방법 및 시스템 (소멸) | Korean Intellectual Property Office | 2012 |